






🛡️ Lock in peak CPU stability and never worry about warping again!
The Thermalright CPU Contact Frame is a precision-engineered retrofit kit designed to prevent CPU bending and overheating on Intel 12th and 13th Gen LGA1700 motherboards. Crafted with durable CNC gold anodized materials and including a thermal interface pad, it ensures enhanced thermal performance and long-lasting protection, all while being easy to install with included tools.






| UPC | 796345713735 |
| Country of Origin | USA |
| Model number | LGA1700-BCF-BLACK |
| Item Weight | 9.07 g |
| Product Dimensions | 7 x 5.3 x 0.6 cm; 9.07 g |
| Item model number | LGA1700-BCF-BLACK |
| Item Height | 0.6 Centimeters |
| Item Width | 5.3 Centimeters |
| Cooling type | forced convection |
| Type of connector | 3-pin |
| Wattage | 12.8 Watts |
| Noise Level | 0.08 Decibels |
| Compatible Device | Desktop |
| Are batteries included? | No |
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