Preventing Thermal Cycling and Vibration Failures in Electronic Equipment

Dave Steinberg is probably the best known source for practical thermal as well as shock and vibration manual (pencil and paper) analysis of electronic systems. His approach, both in his books and in the three day seminars that he used to give, was aimed at the non-analyst engineer, and enabled many people to bridge the gap between the theory they learned in school and practical applications. His methods focused on manual calculations, and addressed the components and types of electronic system designs that were in use in the 1970s and 1980s, which is the time period when Steinberg was developing his approach. This book contains a good bit of the content from his other two well-known books (Vibration Analysis for Electronic Equipment and Cooling Techniques for Electronic Equipment). This volume includes some updated information relating to more modern package types, but still falls short of comprehensive treatment of modern packaging. Modern thermal and vibration analysis is dominated by computer methods, but Steinberg's books impart a sense of how the physical world works. For this reason, this book and his two others will remain valuable to the working engineer.

One of my go-to books for aerospace/mechanical engineering design.

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