K4-PRO low viscosity thermal paste is developed and produced by Computer Systems laboratories research department. This product was developed as part of C.S. Labs BGA rework research project with the support of Greece and Europian Union. This product is designed to reduce the chances of BGA component failure for reasons related to overheating. This listing is offering 500g of K4-PRO thermal paste. On each application less than 0.2g of K4-PRO is needed so this quantity should be enough for more than 2500 applications!!! You can see our application instructions video on our youtube page " ComputerSystemsGR ". When you should replace the thermal paste / pads in your computer: Thermal paste and thermal pads should be replaced every time that the heat sink is removed (for cleaning, upgrade or other maintenance). Replacing the thermal pads and the gummy thermal paste that is used by Apple on the memory chips is very important if the heat sink is removed because if you reuse the same thermal pads or paste the heat sink is impossible to fit perfectly again and the component will be overheated and will fail soon. If your computer is overheated or turns off after a few hours of use. In this case the entire heatsink system must be cleaned immediately and all thermal paste and thermal pads must be replaced. Price includes VAT 23%. If you are VAT registered in EU please contact us before purchasing and we will offer a quote without VAT. Greek business customers should provide their business info in order to issue a commercial invoice.K4-PRO is produced in EU (Greece) and will be shipped directly from our production center in Thessaloniki Greece.
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